| Item | Specification |
|---|---|
| Layers | 1~30 |
| Board Thickness | 0.1mm-6.0mm |
| Material | FR-4, IMS(aluminum), CEM-3, Polyimide, High Tg, Rogers, PTFE, Alu/Cu Base, FLEX, RIGID-FLEX, etc |
| Max Panel Size | 620mmx1080mm |
| Min Hole Size | 0.08mm |
| Min Line Width/Space | 2mil(0.05mm) |
| Board Outline Tolerance | +- 0.10mm |
| Insulation Layer Thickness | 0.05mm-5.00mm |
| Out Layer Copper Thickness | 18um-420um(H/oz-12/oz) |
| Drilling Hole (Mechanical) | 17um-175um |
| Finish Hole (Mechanical) | 17um-175um |
| Diameter Tolerance (Mechanical) | 0.05mm |
| Registration (Mechanical) | 0.075mm |
| Aspect Ratio | 25:01 |
| Solder Mask Type | LPI |
| SMT Min. Solder Mask Width | 0.075mm |
| Min. Solder Mask Clearance | 0.05mm |
| Plug Hole Diameter | 0.1mm-0.60mm |
| Impedance Control Tolerance | +- 10% |
| Surface Finish | ENIG, ENEPIG, OSP, HASL, Chem. Tin/Sn, Galvanic hard gold, etc |
| Solder Mask | Green/Matt green/YELLOW/Black/Matt Black/White/Red/Blue/Purple |
| Silkscreen | Red/Yellow/Black/White |
| Certificate | UL, ISO 9001:2015 + AS9100D, ISO 14001, ISO 13485, IATF 16949 |
| Special Request | Blind holes/buried holes, Gold finger, Beveled edge, Press-fit, BGA, V.I.P process, Countersink/Counterbore, Carbon ink, peelable mask, Edge plating, Half holes, Ohmique test, etc |
| Material Suppliers | SHENGYI, KINGBOARDS (KB), VENTEC, ROGERS, TAIYO, KSM, etc |
| Common Package | Vacuum+Desiccant+humidity card, Carton |