PCB Fad

Deep intelligence / Precision design / Fast mapping

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PCB Fad

Deep intelligence / Precision design / Fast mapping

Learn more > Use immediately >

PCB Fad

Deep intelligence / Precision design / Fast mapping

Learn more > Use immediately >

Cutting-Edge PCB-Integrated Chips: Powering Next-Gen Electronic Performance

These advanced chips,
optimized for PCB integration,
deliver unparalleled computing power and energy efficiency,
driving innovation in high-tech electronics.

PCB-Enabled Devices: Routers, Tablets & Computers for Enhanced Electronic Experiences

These PCB-integrated routers, tablets,
and computers deliver superior performance,
stable connectivity, and intelligent computing,
empowering diverse electronic applications in the PCB industry.

PCBs for Network
Routers

Thickness	1.0±0.10mm
Material	FR-4
Layers	4
Min Hole Diameter	￠ 0.2mm
Wire Width	0.1mm
Wire Pitch	0.1mm
Impedance Requirements	55.0+/-5 Ω
Surface Finish	OSP

PCBs for Tablet Pcs

Thickness	1.6+0.16mm
Material	FR-4
Layers	6
Min Hole Diameter	￠ 0.2mm
Wire Width	0.1mm
Wire Pitch	0.075mm
Impedance Requirements	55±5Ω
Surface Finish	ENIG

PCB for Computer
Graphics Card

Thickness	1.6+0.16mm
Material	FR-4
Layers	6
Min Hole Diameter	￠ 0.2mm
Wire Width	0.1mm
Wire Pitch	0.075mm
Impedance Requirements	55±5Ω
Surface Finish	ENIG

Q91-1250V2: A New Force for Efficient and Precision Processing in PCB Industry

In the PCB industry, the Q91-1250V2 equipment,
with its innovative design, brings efficient
and precise solutions for circuit board processing,
empowering enterprises to improve production efficiency
and demonstrating strong capabilities in high-end PCB manufacturing.

PCBs for Security Equipment

Thickness	1.0+0.10mm
Material	FR-4
Layers	6
Half-hole design	￠ 0.5mm
Min Hole Diameter	￠ 0.2mm
Wire Width	0.075mm
Wire Pitch	0.075mm
Surface Finish	OSP

PCBs for Medical Machines

Thickness	1.2+0.12mm
Material	FR-4
Layers	4
Golden Finger	30uin
Min Hole Diameter	￠ 0.25mm
Wire Width	0.1mm
Wire Pitch	0.1mm
Surface Finish	ENIG

PCBs for industrial Electrical Applications

Thickness	1.6+0.16mm
Material	FR-4 Tq170
Layers	10
Min Hole Diameter	￠ 0.25mm
copper thickness	210um
Surface Finish	ENIG

HDI PCB

technical	1+4+1
Mechanical Through Hole	L1-L6 L2-L5
laser	L1-L2 L5-L6
Thickness	0.8mm
Material	FR-4 Tg170
Wire Width	0.1mm
Wire Pitch	0.075mm
Min Hole Diameter	￠ 0.1mm(laser) ￠0.3 mm(Mechanical)
Surface Finish	ENIG

HDI PCB

technical	2+6+2
Mechanical Through Hole	L1-L8 L2-L7 L3-L6
laser	L1-L2 L2-L3 L6-L7 L7-L8
Thickness	1mm
Material	FR-4 highTG
Wire Width	0.075mm
Wire Pitch	0.075mm
Min Hole Diameter	￠ 0.1mm(laser) ￠ 0.25mm(Mechanical)
Surface Finish	ENIG + OSP
BGA Size	0.25mm
SMD Size	0.4mm

New Partner for PCB Smart Logistics: AGV Robot Empowers Efficient Material Flow in Workshops

In PCB production scenarios,
this AGV robot enables automated material transportation
with intelligent navigation and flexible operation,
reducing costs and improving efficiency for PCB workshops
and facilitating intelligent manufacturing upgrading.

HDI PCB for UAV

Layers	8
Mechanical Through Hole	L1-L8
laser	L1-L2 & L7-L8
Thickness	1mm
Material	Plolyimide+FR4
Wire Width	0.075mm
Wire Pitch	0.075mm
Min Hole Diameter	￠ 0.1mm(laser) ￠ 0.25mm(Mechanical)
Surface Finish	ENIG
BGA Size	0.25mm
SMD Size	0.4mm

Products for Server Applications

Layers	26
Mechanical Through Hole	L1-L26
Thickness	4mm
Material	FR-4 highTG
Wire Width	0.1mm
Wire Pitch	0.1mm
Min Hole Diameter	￠ 0.35mm
Surface Finish	ENIG
BGA Size	4mm
SMD Size	0.35mm